







































FC01 design (the one die that has pads but no pad ring at all).
I wonder if someone with a multimeter or such may feel like probing some of the obvious continuity/dis-continuity on one of them to sooth the worries.....



BISCUT
Can you share the project code? https://github.com/wafer-space/ws-run2
Also all of the dies should be represented above.

BISCUT
Can you share the project code? https://github.com/wafer-space/ws-run2
Also all of the dies should be represented above. 




BISCUT
Can you share the project code? https://github.com/wafer-space/ws-run2
Also all of the dies should be represented above. ? secret designs?

? secret designs? 










FC01 design (the one die that has pads but no pad ring at all).
I wonder if someone with a multimeter or such may feel like probing some of the obvious continuity/dis-continuity on one of them to sooth the worries..... 


private: bool in the manifest or something, I can just have the machine take some pics and potentially stitch together a reticle and auto-blackout the ones we don't want
*keep in mind the resolution leaves a lot to be desired.
Also I'm unlikely to have this microscope in Sg, so that's another thought if we even want to keep doing this (I think we do)











































FC01 dies with the tester and the few FlexMem COBs.
Do we have an estimated shipping date for the COBs, assuming that things go as smoothly as can reasonably be expected? Ofc. no promises. More trying to estimate how soon I gotta be ready to probe them, such that I'm not to blame for delayed test results.

FC01 dies with the tester and the few FlexMem COBs.
Do we have an estimated shipping date for the COBs, assuming that things go as smoothly as can reasonably be expected? Ofc. no promises. More trying to estimate how soon I gotta be ready to probe them, such that I'm not to blame for delayed test results. 








